Description

Compatible with robotic soldering systems, this solder wire provides excellent wettability, rapid tinning performance, smooth fluidity, low spattering, and clean, bright solder joints. No post-soldering cleaning is required, making it highly suitable for robotic soldering applications and automated soldering equipment.

F68 Lead-Free Automatic Soldering Wire

Product Model: SN99.3Cu0.7

Melting Point: 225-229℃

Flux Content: 2.3±0.2%

Wire Diameter: 0.5-5.0mm

Product Weight: 500-1000g/roll

Packaging Specification: Roll packaging

Country/Region of Origin: China/Ningbo

Environmental Certifications: RoHS, REACH

Product Applications

F68 Lead-Free Automatic Soldering Wire is designed for a wide range of soldering applications, including electronics, instrumentation, household appliances, and printed circuit board (PCB) assembly. It is also suitable for soldering nickel-plated surfaces and stainless steel components, providing reliable bonding performance across different materials.

Product Features

• Designed for compatibility with robotic soldering systems and automatic soldering machines.

• Provides high wettability for efficient solder flow and strong bonding performance.

• Enables fast tinning speed, improving production efficiency in automated manufacturing processes.

• Features excellent fluidity to ensure smooth solder spreading and consistent results.

• Produces minimal spatter during soldering, helping maintain a cleaner working environment.

• Creates bright and reliable solder joints with a professional finish.

• No-clean flux formula eliminates the need for additional cleaning after soldering, simplifying production procedures.

With its stable performance, environmental compliance, and strong adaptability, F68 Lead-Free Automatic Soldering Wire is an ideal solution for modern automated soldering applications requiring efficiency, reliability, and high-quality solder joints.